The first of the two days of Intel Innovation opens with the presentation of the thirteenth generation processors, the Developer Cloud extension, the Intel Geti computer vision platform, and a greater choice of graphics
On the occasion of the second edition of the annual event Intel Innovationthe developers of hardware e software, came together to announce the most recent steps towards creating an ecosystem based on the principles of openness, choice and reliability, from the promotion of open standards to make “chip systems” possible already at the silicon level, up to enable artificial intelligence multi-architecture efficient and portable.
Also, it is shown new hardware, software and targeted services to help the ecosystem of developers overcome the challenges they face and to deliver new generations of innovative products.
Pat GelsingerCEO of Intel, said:
In the next decade we will see a generalized and continuous digitization. Five fundamental technological superpowers – computing power, connectivity, infrastructure, artificial intelligence and sensing – will shape the way we experience the world. Developers, focused on both software and hardware, will build this future. They are the true magicians who carry out what is possible. Promoting this open ecosystem is at the heart of our transformation, and the developer community is essential to our success.
In his keynote address of the event, Gelsinger presented a series of challenges, that developers they face, vendor lock-in, access to the latest hardware, productivity and time-to-marketsecurity, just to name a few and, has presented multiple solutions to overcome them, including:
Developer Cloudalong with developer tools and resources designed to optimize performance, including toolkit oneAPI and, the Geti platform, help accelerate time-to-market for solutions based on Intel platforms.
Gelsinger, also showcased the latest advancements from Intel’s product portfolio, including:
Leader of Samsung e TSMC, joined Gelsinger in his keynote to support the Universal Chiplet Interconnect Express (UCIe) consortium, which aims to create an open ecosystem to allow chiplets designed and manufactured on different process technologies by different vendors to work together when integrated with advanced technologies of packaging. With the three major chip makers and more than 80 companies leaders in the semiconductor industry who joined UCIe.
Intel and Intel Foundry Services will usher in the era of systems foundry, with four major components: wafer manufacturing, packaging, software, and an open ecosystem for chiplets. “Innovations that were once thought impossible have opened up entirely new possibilities in chip manufacturing.
Intel premiered another innovation under development: a revolutionary fotonica co-package pluggable. Optical connections promise new levels of bandwidth in connections from chip a chipparticularly in data centers, but production difficulties make them unsustainable.
To overcome this, Intel researchers have devised a robust, high-performance, glass-based solution with a pluggable connector that simplifies manufacturing and reduces costs, opening up possibilities for new systems and chip package architectures in the future.
Building the future requires software, tools and products, and it also requires funding. Earlier this year, Intel launched theIFS Innovation Fund, of a billion dollars to support the startups and companies claim that they create disruptive technologies for the ecosystem of foundry.
The company announced the recipients of the first round of funding, a diversified group that is innovating across the entire semiconductor industry. Between these:
What do you think of these tools that Intel provides developers to solve challenges? Let us know below in the comments. Don’t forget to follow us on our Instagram page, on all our other social networks and to stay connected on TechGameWorld.com.
The Intel article gives developers the tools to solve the challenges comes from TechGameWorld.com.
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