Qualcomm could replace eSIMs with iSIMs directly mounted on Snapdragon chips

The era of e.g has just risen, but may set very soon, since Qualcomm has every intention of introducing le iSIM water chip Snapdragon 8 Gen 2.

Qualcomm would be focusing on iSIM

If last year the company had presented a modified version of the Galaxy Z Flip 3 to launch the iSIM idea, this year Qualcomm surprises by combining the technology of these new cards with its latest creature: the Snapdragon 8 Gen 2.

The iSIM version, created in collaboration with Thales (global leader in advanced technologies), has received the certification GSMAthus offering the same level of security and connectivity as eSIMs.

“We are very pleased to see our investment in high assurance processor hardware security, in partnership with Thales, achieve the security and functionality required by the GSMA for the UICC use case of Remote Provisioning.

We believe that a tamper-resistant element integrated within the host processor can efficiently enable innovative use cases across many markets and product segments,” he said. Ziad Asghar, senior vice president of product management, Qualcomm Technologies, Inc.

Why did Qualcomm decide to focus on this new technology?

Probably because iSIMs, compared to the others, are up to 100 times smaller, measuring just 1 square millimeter. This makes it much easier to slot them directly into the Snapdragon 8 Gen 2 processor and eliminate the need for a SIM card tray.

Furthermore, iSIMs are more convenient from one point of view energeticallowing for longer battery life.

In the not too distant future, therefore, the first phones with this new technology could be marketed. Summing up, in an abstract timeline, the goal is to place on the market, by 2030, circa 300 million iSIM smartphonesincluding future phones in the range Samsung Galaxy.