Intel and Arm: multi-generation agreement for low-power chips

Intel Foundry Services (IFS) e Arm today announced a multigenerational deal. This is to allow chip designers to make system-on-chip (SoC) of low-power processing on the Intel 18A process. The collaboration will first focus on SoC designs mobile. Not only that, it also allows for potential project expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications.

The next generation system-on-chip takes advantage of Intel 18A process technology

Arm customers designing their own next-generation mobile systems-on-chip will benefit from the cutting-edge Intel 18A process technology. This offers revolutionary new transistor technologies to improve power and performance. Also from IFS’ robust manufacturing footprint which includes US and EU based capabilities.

“There is a growing demand for computing power driven by the digitization of everything. But until now, fableless customers have had limited options to design around the latest mobile technology,” he said Pat Gelsinger, CEO at Intel Corporation. “Intel’s collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fableless company that wants access to best-in-class CPU IP and the power of an open systems foundry with cutting-edge process technology ”.

“Arm’s secure and energy-efficient processors are at the heart of hundreds of billions of digital devices and experiences on the planet.” This is what was stated by Rene Haas, CEO of Arm. “As demands for processing and efficiency become ever more complex, our industry must innovate at many new levels. Arm’s collaboration with Intel allows IFS to become a critical foundry partner for our customers as we deliver the next generation of world-changing products built on Arm.”

Intel’s IDM 2.0 strategy

Within his IDM 2.0 strategyIntel is investing in state-of-the-art manufacturing capabilities around the world, including significant expansions in the US and the EU, to meet the long-term sustained demand for chips. This collaboration will enable a more balanced global supply chain for foundry customers working in the design of mobile SoCs on Arm-based CPU cores.

By unlocking Arm’s cutting-edge computing portfolio and world-class IP on Intel process technology, Arm’s partners will be able to take full advantage of the Intel’s open system fusion modelwhich goes beyond traditional wafer fabrication to include packaging, software, and chiplets.

IFS and Arm will embark on design technology co-optimization (DTCO). In which chip design and process technologies are optimized together to improve power, performance, area and cost (PPAC) for ARM cores targeting Intel 18A process technology. Intel 18A offers two revolutionary technologies. The first is PowerVia for optimal power delivery and transistor architecture RibbonFET gate all around (GAA) for optimum performance and potency. THE

FS and Arm will develop a mobile reference design, enabling demonstration of software and system knowledge for foundry customers. As the industry evolved from DTCO to System Technology Co-Optimization (STCO), Arm and IFS will work together. The goal is to optimize platforms from applications and software through packages and silicon, leveraging Intel’s unique open system foundry model.