AMD and MediaTek announced – on Friday, November 19, 2021 – the collaboration to jointly design industry-leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The announcement coincided with the MediaTek 2021 Executive Summit.
Filogic 330P chipset, included in AMD’s ever-expanding Wi-Fi solution portfolio, will power the next generation of laptops AMD Ryzen and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.
Saeid Moshkelani, SVP and general manager of the AMD client business unit, said: “We believe that the combination of powerful AMD Ryzen processors with MediaTek’s leadership in advanced connectivity technologies will provide an overall incredible computing experience.”
“MediaTek is already a leader in Wi-Fi in several industries, including smart TVs, routers and voice assistants. The new Filogic 330P chipset – said Alan Hsu, vice president and general manager of Intelligent Connectivity at MediaTek – has further expanded our connectivity portfolio as we continue to expand our presence in the PC market, ”he added,“ With this high-speed, ultra-low-power chipset that powers the next generation of AMD laptops, consumers will be able to enjoy seamless connectivity and longer battery life while gaming, streaming and video chatting ”.
“Having fast and reliable wireless connectivity is critical, especially as consumer speed, bandwidth and performance demands increase due to the increase in video calling, streaming and gaming,” then concluded Saeid Moshkelani, “We believe that the combination of powerful AMD Ryzen processors with MediaTek’s advanced connectivity technologies can deliver an incredible, well-rounded computing experience to our users.”