Two new chipsets without active cooling. MSI shares as much information as possible about the new AMD AM5 platform
MSIduring the Computex 2022, has made public another news regarding AMD’s new products, namely that relating to chipsets without active cooling. The company (click here for more information) has already disclosed the technology AMD EXPO for the profiles of DDR5 memory overclocking.In addition, it has also published a guide to installing the CPU of the AMD Ryzen 7000.
AMD’s reaction to the news of chipsets without active cooling
AMD clearly wasn’t happy that MSI was so straight forward with all this information. After all, the Computex it was just a showcase, not a complete revelation. Therefore, some of this information has already been removed at AMD’s request. But clearly MSI isn’t bothered. During their MSI Insiderthe company showed the design del chipset AMD X670 without the heat sinks. This is actually the first time we’ve seen the dual-chipset design, which AMD had confirmed without ever showing the public yet.
AMD X670 motherboard
The platform AMD AM5 con socket LGA1718 will contain a CPU fino a 170 W PPT. The first generation AM5 CPUs will be based on the architecture Zen4 with support for DDR5 memory and PCIe Gen5 devices. THE chipset X670E e X670 with their dual chipset design they will offer up to 24 lanes PCIe Gen5 for graphics and archiving. Although it has already been confirmed by AMD, the new chipsets X670 do not require active cooling. This will be largely limited to the design of the series motherboards AMD 600it will reduce development costs and also lead to less energy expenditure.
AMD X670 chipset cooling
The Ryzen 7000 e X670 they are just a taste of what will be released this fall (officially). AMD has promised to provide more details this summer. Motherboards B650 they must feature a single chipset design, so that should mean even smaller heatsinks.
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Chipset article without active cooling: confirmation from MSI comes from TechGameWorld.com.