In June of this year, we learned that Honor had begun work on his first foldable phone, at the time there were rumors that the upcoming device would feature foldable panels of BOE e Visionox. While we haven’t seen any new information about the device since, Honor just shared a teaser that gives us a glimpse of its design and confirms its name: Honor Magic V.
Ecco Honor Magic V
Honor Magic V sarà Honor’s first foldable phone and, as highlighted in the teaser, it will be equipped with a leading hardware compartment. It is therefore to be expected that it will be equipped with Qualcomm’s new Snapdragon 8 Gen 1 chip, as the company has flagged Honor as one of the first OEMs to use the new chip. However, Honor has not disclosed any specific information about the device’s hardware.
The teaser image offers a close look at the design of the device, but doesn’t reveal much else about the device. In a press release accompanying the image of the teaser, the company announces that Honor Magic V will arrive on the Chinese market soon, but the company doesn’t mention anything about international availability. We expect to hear more about the device in the days leading up to launch.
The new smartphone will therefore join the growing list of flagship foldable products from Chinese companies very soon. It will compete with the recently launched Find N from OPPO, the Xiaomi Mi MIX Fold, the Huawei Mate X2 and the upcoming Huawei P50 Pocket. It will probably have a slightly more affordable price, in such a way as to be more competitive on the market at the time of its launch.