The alleged details about the future begin to leak out onto the Net Apple’s silicon chip that will succeed the M1, M1 Pro and M1 Max of the first generation. Apparently, these will be produced based on the 5nm process of TSMC, the company’s chip manufacturing partner. In fact, from a recent report shared by The Information, the two companies are working to bring significantly improved second generation chips. But the great expectations would even have on those of the third. Let’s find out what it is in detail.
Apple: Third generation chips will be significantly improved
But The Information’s Wayne shared a report that provides some interesting details about Apple’s future chips, which appear to have two dies, allowing for more cores as a result. These will reportedly be used in the next few MacBook Pro e iMac. But Apple is planning a “much bigger leap” with its third generation chips, some of which will be produced with the 3 nm process of TSMC and will have up to four dies, which could result in chips with up to 40 compute cores. For comparison, just think that the M1 chip has an 8-core CPU, and the M1 Pro and M1 Max chips have 10-core CPUs.
From what was leaked from the report, TSMC will be able to reliably produce 3nm chips by 2023, for use on both Mac and iPhone. In detail, the third-generation chips are codenamed Ibiza, Lobos and Palma, and are likely to debut first in high-end Macs such as the MacBook Pro 14-inch and 16-inch. Although a less powerful third-generation chip would appear to be expected for a future MacBook Air. Meanwhile, the upcoming Mac Pro will use a variant of the Apple M1 Max chip with at least two dies.