GIGABYTE introduces AMD X670 motherboards

GIGABYTE presenta le schede madri AMD X670

The advanced design of SMD PCIe 5.0 x16 and M.2 SSD slots greatly improves the stability and simplicity of assembly, let’s discover together the AMD X670 motherboards from GIGABYTE

GIGABYTEa leading manufacturer of motherboards, video cards and hardware solutions, has announced the launch of the new motherboards AMD X670which include the two chipset segments X670E e X670 and reveal an abundance of noteworthy features. Top-of-the-range models X670E natively support graphics cards PCIe 5.0 with an advanced slot design, while the models mainstream X670 incorporate video card slots PCIe 4.0.

The series is equipped with slots PCIe 5.0 M.2 with technology PCIe e M.2 EZ-Latchwhich makes it easy to upgrade video cards and SSD M.2 for users, protecting surrounding components from accidental damage. Furthermore, it Smart Power Stage da 105 Amps e 18+2+2 direct-fed phases, and the 8-layer PCB offer greater stability, optimal compatibility and performance for the next processors AMD Ryzen of the 7000 series. Thanks to the advanced thermal design, the temperature of the VRM is reduced. This stabilizes the power and performance of the slot PCIe x16 e dell’SSD M.2avoiding thermal throttling.

Meanwhile, the improved design of the shield degli slot SMD, it strengthens the stability of the signal as well as the structure of the slots. Furthermore, this series relies on technology Active OC Tuner and, on the brand new software GCC (GIGABYTE Control Center) in combination with the new PCIe5.0 M.2 SSD from GIGABYTE and the DDR dual mode EXPO/XMPoffering extreme performance with a more user-friendly user experience.

GIGABYTE introduces AMD X670 motherboards

The statements of David McAfee and Jackson Hsu

David McAfeeCorporate Vice President e General Manager, Client Channel Business Unit, AMD, ha affermato:

The new range of GIGABYTE X670 motherboards offers unique features and new designs, maximizing the excellent performance and multifunctional capabilities of the AMD Ryzen 7000 series processors. The AM5 platform is well supported to deliver the best-in-class experience AMD users can expect. .

Jackson HsuDirector of GIGABYTE Channel Solutions Product Development Division, said:

GIGABYTE has constantly innovated with high-quality, high-performance motherboards with low temperatures and an intuitive user interface. GIGABYTE X670 motherboards are designed for performance, for convenience users and professional designers, and harness the power of 18 + 2 + 2 phase direct digital power design, advanced VRM thermal solution, innovative EZ-Latch design , PCIe 4.0 sets or even PCIe 5.0 M.2 SMD interfaces with thermal shield, lightning-fast LAN and further R&D advancement. This series is sure to impress those on the hunt for performance and stability and become the perfect choice for high-end users planning to build AMD platforms.

GIGABYTE introduces AMD X670 motherboards

Designed with a smooth user experience in mind

The range of motherboards AMD X670 GIGABYTE, is designed with a smooth user experience in mind, with technology PCIe e l’M.2 EZ-Latch on all X670 models, and the advanced EZ-Latch Plus, on all models X670Efor quick release of video cards e SSD M.2. With the size of next generation graphics cards increasing, achieving traditional PCIe release latching can be difficult. Technology EZ-Latch incorporates an easily accessible button, which simplifies the release of installed cards and reduces the risk of accidentally damaging the card.

At the same time, the exclusive slots SMD PCI ex16, new generation are designed with an enhanced protective cover that provides reinforced tensile strength and robust design, increasing cut resistance up to 2,2 volte. GIGABYTE X670 motherboards all adopt PCIe 5.0 M.2 slot with design M.2 EZ-Latch and EZ-Latch Plus. Existing M.2 SSD screws have been replaced by automatic or manual locking systems, which reduce screw alignment or loss issues and greatly improve the user experience when installing M.2 SSDs.

GIGABYTE introduces AMD X670 motherboards

18 + 2 + 2 phase direct digital power supply system

In response to the release of the newest socket and processor architecture AMD Ryzen serie 7000the motherboard X670E AORUS XTREME boasts a direct digital power supply system a 18 + 2 + 2 phases, with each Smart Power Stage, capable of delivering up to 105A to guarantee the best in terms of power management and load balancing of the power phases.

This guarantees a more stable energy flow that allows you to unleash the extraordinary performance of the new processors and the extreme potential of theoverclock multi-core all-core. In addition, GIGABYTE X670 motherboards incorporate the technology of overclocking attivo Active OC Tuner.

The CPU overclocking frequency and, the number of operating cores can be dynamically changed by choosing from the default precision overclocking mode, the PBO (Precision Boost Overdrive) and manual overclocking, according to the different configuration needs in use and the characteristics of the applications running. This technology allows users to run each application with the CPU frequency and number of cores needed to enjoy maximum performance.

Theoretical speed of 5200 MHz

Motherboards support, exclusively DDR5 at the theoretical speed of 5200 MHz, and they offer the famous Shielded Memory RoutingSMD memory DIMM and double metal protection to allow users to enjoy premium memory overclocking performance with more stability.

The X670 range features memory overclocking optimization in the BIOS, to support both AMD EXPO 2, that Intel XMP. GIGABYTE supports technology dual-mode AORUS XMP e AMD EXPOwhich allows high-speed operations and eviscerates the extreme performance of DDR5-6400 with ease.

GIGABYTE introduces AMD X670 motherboards

Advanced thermal solutions

To globally improve the heat dissipation in conditions of overclocking and running at maximum speed, motherboards are equipped with advanced thermal solutions such as the Fins-Array III technologythe new design Direct-Touch Heatpipe and, a full-coverage heat sink VRM.

At the same time, surface mount technology SMD, purifies the signal of PCIe 5.0 M.2 slots, to reduce interference and process high-speed data streams more easily Gen5. In addition, the reinterpretation of the space surrounding the M.2 slots allows support for the new form factor SSD M.2 25110.

The innovative Thermal Guard III heatsink with thermal pads up to 12 W/mK, can greatly improve the heat dissipation efficiency and ensure lightning-fast performance with the latest SSD NVMe without thermal throttlingincreasing the stability of the system by nearly a 50%. GIGABYTE will soon release the SSD AORUS PCIe 5.0 M.2 next generation, achieving maximum transfer rates that allow the transfer of large amounts of data in a fraction of a second.

In addition, the expanded thermal shield can support four sets of PCIe 5.0 or 4.0 M.2 SSDs in RAID, with high-speed, low-temperature performance. Further improved by the fan mount PWM/DCmultiple temperature detectors, regulation mode of double 7-phase curved fan and Fan Stoptechnology Smart Fan 6 ensures that the processor, i VRM, the chipset or key components can operate without throttling or performance degradation.

GIGABYTE introduces AMD X670 motherboards

2.5 Gbps Ethernet connection speed

The entire X670 series offers connection speeds Ethernet a 2,5 Gbps, which allows gamers to have faster and more stable wired network connectivity. All models enabled WIFI of the range are equipped with Wi-Fi 6E 802.11ax, which offers blazingly fast connection speeds of 2,4 Gbps, that rival the Ethernet connection speed of 2.5 Gbps.

With both Ethernet and high-speed WIFI, users have extra flexibility and blazing fast connection speeds. The GIGABYTE X670 range is also equipped with USB 3.2 Gen 2×2 Type-C, with bandwidth up to 20 Gbps for ultra-fast transfer rates. With external SSD VISION DRIVE 1TBusers can take full advantage of high-speed data transfer.

GIGABYTE Control Center

The company also unveiled a new simplified software, called GCC (GIGABYTE Control Center) which replaces the traditional utility APP Center. Conceived as a new management tool, GCC classifies the user’s applications by relying on a completely redesigned interface.

This new software automatically detects the user’s hardware configuration and downloads any appropriate related applications to back-end, bringing everything together in a single portal. Thus, it will now be easier for users install, update and manage various useful applications to take full advantage of all the advantages of the products.

GIGABYTE introduces AMD X670 motherboards

Extraordinary features

X670 motherboards are equipped with extraordinary featuresincluding the note Q-Flash PLUStechnology Ultra Durable, which constitutes the supreme choice for users to assemble a high-end PC system and enjoy the unique technologies of GIGABYTE. For more information and product news, visit the dedicated website.

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GIGABYTE article introduces AMD X670 motherboards comes from allotek.