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Nodes N3 FinFlex, N3E and N2 and 3DFabric: the announcement of TSMC

Announced the new N3 FinFlex, N3E and N2 and 3DFabric nodes from TSMC

TSMC (here for more info) today unveiled the most recent innovations in its advanced logic, specialties and technologies IC 3D al North America Technology Symposium 2022 of the company. We were able to admire the process N2 cutting-edge next generation, powered by transistor nanosheet and exclusive technology FINFLEX for N3 and N3E the latest trials to the total debut.

Picking up as an in-person event after being held online for the past two years, the North American Symposium in Santa Clara, California, will kick off a series of technology symposiums around the world in the coming months. The Symposia also feature an Innovation Zone highlighting the achievements of TSMC’s emerging customers in the start-up phase.

Nodes N3 FinFlex, N3E and N2 and 3DFabric: the announcement of TSMC

Statements of his new nodes N3 FinFlex, N3E and N2 and 3DFabric

Below we have reported for you the first statements regarding the new nodes presented by TSMC.

We live in a rapidly changing, supercharged digital world where the demand for computational power and energy efficiency is growing faster than ever. This is creating unprecedented opportunities and challenges for the semiconductor industry,

said the Dr. C.C. Wei, CEO of TSMC. Then adding

The innovations we will present at our Technology Symposiums demonstrate TSMC’s technology leadership and our commitment to support our customers during this exciting period of transformation and growth.

Technical details on N3 FinFlex, N3E and N2 and 3DFabric nodes

TSMC’s industry-leading N3 technology, set to go into series production in late 2022, will feature groundbreaking architectural innovation TSMC FINFLEX. This offers unprecedented flexibility for designers. TSMC FINFLEX innovation offers choices of several standard cells with a configuration a 3-2 fins for ultra performance. And again, a configuration a 2-1 pin for best energy efficiency and transistor density and a 2-2 fins which provides a balance between the two.

With the TSMC FINFLEX architecture, customers can create projects system-on-chip ottimizzati for their needs. With functional blocks that implement the fin configuration optimized for the desired performance, power and target area and integrated on the same chip. For more information on FINFLEX, please visit.

Nodes N3 FinFlex, N3E and N2 and 3DFabric: the announcement of TSMC

N2 technology

TSMC’s N2 technology represents another notable advance over N3. With an improvement in the speed of the 10-15% at the same power, or a reduction in the power of the 25-30% at the same speed ushering in a new era of efficient performance. N2 will present an architecture a transistor nanosheet to offer a complete improvement in performance and energy efficiency. This will enable next generation product innovations by TSMC customers. The N2 technology platform includes a high-performance variant in addition to the version mobile computing baselineas well as complete chiplet integration solutions. N2 is expected to start production in 2025.

Other advances

Building on the success of technology N12e announced at Technology Symposium 2020TSMC is developing N6e. This will represent the next evolution in process technology optimized to deliver the computing power and energy efficiency required by edge AI and IoT devices. N6e will be based on the advanced process a 7 nm di TSMC and should have a logical density three times greater than N12e. It will serve as part of the platform Ultra-Low Power by TSMC. A comprehensive portfolio of logic, RF, analog, embedded non-volatile memory and power management IC solutions for applications in artificial intelligence and the Internet of Things.

Nodes N3 FinFlex, N3E and N2 and 3DFabric: the announcement of TSMC

TSMC 3DFabric 3D Silicon Stacking Solutions

TSMC introduces two revolutionary applications for user customers of chip stacking TSMC-SoIC.
The first CPU in the world based on SoIC which uses Chip-on-Wafer (CoW) technology to stack SRAM as a level 3 cache. An innovative intelligence processing unit stacked atop a deep trench capacitor that uses the technology Wafer-on-Wafer (WoW).

Con i chip N7 already in production for both CoW than for WoWsupport for technology N5 is scheduled for 2023. To meet customer demand for SoIC and other system integration services 3DFabric TSMCthe world’s first fully automated 3DFabric factory will begin production in the second half of 2022.

And what do you think of these new knots N3 FinFlex, N3E e N2 e 3DFabric? tell us yours below in the comments and stay connected on, for the latest news from the world of technology (and more!).

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With a sharp focus on technological advancements, Clare keeps readers informed about the cutting-edge innovations, breakthroughs, and trends in the hardware industry. From new computer components and peripherals to advancements in hardware technology, Clare's articles provide comprehensive coverage, ensuring readers stay up-to-date with the ever-evolving hardware landscape.