TEAMGROUP at COMPUTEX 2023: many news announced. Introduce exceptional new products reaching new technological heights
TEAMGROUP, a leading brand in the memory sector, returns to COMPUTEX 2023 with the theme “DAZZLE．CHILL．INTEGRATE”. It unveiled six new products in the categories of memory, cooling solutions and storage devices. These products will be shown for the first time at COMPUTEX (5/30-6/2). Showcasing the latest cooling solutions and TEAMGROUP “aurora” RGB lighting technology as the highlights of the grand exhibition. This year’s exhibition is divided into two exhibition areas for the new products of T-FORCE and T-CREATE. In addition to a large gradient LED screen showcasing T-FORCE’s industry-leading RGB technology, there will be physical display areas for new products. Each of which will create an immersive interactive experience.
TEAMGROUP al COMPUTEX 2023: T-FORCE XTREEM ARGB DDR5
The T-FORCE XTREEM ARGB DDR5 features innovative light tubes. These use translucent black acrylic and multi-optic designs to display an aurora-like stream of light. XTREEM ARGB DDR5 matte heat spreader is made of high quality 2mm black aluminum alloy. This one has been subjected to aluminum extrusion, CNC machining, sandblasting and black anodizing; all this to create a unique material that combines the hardness and durability of basalt and the soft texture of black beach sand. It is available in a variety of frequencies ranging from 7,000 MHz to 8,266 MHz. It has also been specially designed for gamers who crave extreme performance and dazzling RGB lighting.
T-FORCE XTREEM DDR5: Extreme overclocking and invincible cooling
New T-FORCE XTREEM DDR5 Overclocking memory is available in frequencies from 7,000MHz~8,266MHz. Offering the fastest speeds in the entire T-FORCE DDR5 series. To achieve the maximum overclocking potential, XTREEM DDR5 uses a 2mm thick high-quality aluminum alloy heat spreader. Added to this is a highly thermally conductive silicone gel to provide a superb cooling effect. The two-piece heat spreader has an oblique fin design and is treated with sandblasting and black anodizing. This gives it a low-key matte texture reminiscent of black beach sand. On top, the glorious T-FORCE logo adds a majestic and elegant touch to the overall look.
T-FORCE SIREN GA360 ARGB All-In-One CPU Liquid Cooler
T-FORCE SIREN GA360 ARGB All-In-One CPU Liquid Cooler was developed in cooperation between T-FORCE and ASETEK Designworks. It is equipped with the latest seventh generation ASETEK V2 pump, new generation high-efficiency motors and PWM intelligent control technology. This allows for precise, real-time adjustment of water block motor and fan speeds based on CPU temperatures. Producing optimum cooling efficiency with minimal energy consumption.
World-class cooling performance makes it perfect for next generation Intel and AMD multi-core CPUs. The liquid cooler uses a water block and an ARGB “aurora” fan and supports various lighting control schedules. Offering players a stunning aurora-like display. In the spirit of eco-friendliness, the entire production process of SIREN GA360 complies with the RoHS directive, and the packaging is made of recyclable materials. Allowing the GA360 to deliver incredible gaming performance and support a greener environment. In addition to showcasing the GA360, TEAMGROUP will show the industry’s first all-in-one SSD liquid cooler at COMPUTEX, which is specially designed for Gen5 PCIe SSD with Taiwan invention patent.
TEAMGROUP al COMPUTEX 2023: serie T-FORCE DARK AirFlow Cooler / SSD M.2 PCIe Gen5
The T-FORCE DARK AirFlow Cooler Series / Gen5 M.2 PCIe SSD is expected to achieve maximum sequential read and write speeds of over 12,000 MB/s and 11,000 MB/s, respectively. Making it T-FORCE’s fastest flagship PCIe Gen5 SSD. The T-FORCE DARK AirFlow cooler features a uniquely designed aluminum fin heatsink with multiple layers and through heat pipes. These significantly increase the thermally conductive area. Together with an active fan cooler and faceted cooling design, it helps the M.2 PCIe Gen5 SSD eliminate heat sources and maintain optimum operating temperatures when running at full speed. The T-FORCE Gen5 M.2 PCIe SSD also supports SMART, a patented intelligent monitoring software. This allows users to understand SSD status information at a glance, and to perform checks and adjustments quickly and easily.
TEAMGROUP C231 USB3.2 Gen 2 Flash Drive
EAMGROUP C231USB Flash Drive is equipped with high-speed USB3.2 Gen 2 interface. Maximum read and write speed up to 1000MB/s and large capacity up to 2TB. This allows you to easily transfer 4K UHD video, access high-definition images or back up large amounts of files. C231 uses a Type-C connector, which is supported by a variety of devices and allows for easy insertion due to its symmetrical shape. Its convenient push-and-slide mechanism also eliminates the need to keep the cap, making data transfers even easier. The elegant matte black metal exterior of C231 adds a touch of style to users’ daily device collection, while the keyhole design allows it to be clipped to keychains, backpacks or other accessories for easy carrying and storage on the go.
TEAMGROUP at COMPUTEX 2023: TEAMGROUP C175 ECO USB3.2 Gen1 Flash Drive
TEAMGROUP C175 ECO USB3.2 Gen1 Flash Drive is made with 75% PCR (post-consumer recycled) plastic and reduces carbon emissions by up to 69%. In perspective, for every 100,000 C175 ECOs, 203,000 sheets of A4 paper are eliminated. In addition to giving a new life to recycled plastic, C175 ECO is equipped with a hidden storage clip which reduces the possibility of cork loss and therefore environmental pollution. With the reduction of carbon dioxide emissions, eco-friendly designs and green living, we can better protect our planet.
With the rapid development of DDR5 DRAM and PCIe Gen5 SSD, TEAMGROUP continues to be an industry pioneer with 26 years of rich market experience and strong R&D capabilities. This year at COMPUTEX 2023 there will be six brand new products that will be presented; a full range of high-end memory, storage devices and hardware peripherals. They will also aptly showcase the core design concept of TEAMGROUP: “DAZZLE．CHILL．INTEGRATE”. We invite all partners to visit our booth at COMPUTEX 2023 to have a visually stunning experience and discover our ever-growing product development capabilities.
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