TSMC, will begin research on 1.4nm process technology in June
Taiwan Semiconductor Manufacturing Cohas defined a roadmap for its manufacturing process N2 (class 2 nm), which will enter production ad high volume (HVM) in 2025, it is time for the company to start considering another node. According to a recent report, TSMC will formally reveal its classy technology 1.4 nm in June.
Business Korea states that TSMC aims to move the team that developed its node N3 (class 3 nm) to the development of its class manufacturing process 1,4 nm in June.
Chip foundries and designers they rarely openly announce R&D milestones, so TSMC is unlikely to issue a press release stating that development of its 1.4nm technology has begun.
TSMC will host his Technology Symposium in mid-June, during which the company will be able to provide brief details on the node that will replace its production process N2.
The phases of the design flow of standard process technology are the pathfinding, research and development. Pathfinding includes fundamental materials, and physical research is often conducted simultaneously for several nodes.
TSMC’s pathfinding for N2 is likely to be completed at this point, teams focus on fundamental physics and chemistry, are working on a successor for N2, which can be designated as 1,4 nm o 14 angstrom.
TSMC’s N2 is based on transistor field effect gate-all-around (GAAFET), although it will use the extreme ultraviolet lithography (EUV) existing with a numerical aperture of 0,33 (0.33 NA).
Given the current information on TSMC’s N2, it is likely that its successor will keep i transistor GAAbut the main question is whether it will switch to tools EUV with 0.55 NA (or NA elevated).
Considering that the N2 reaches theHVM at the end of 2025 (we therefore expect the former chip since 2nm of the company will be delivered around 2026) and the cadence of introduction of the node from two and a half to three years, we can expect 1.4 nm of TSMC (or 14 angstroms) to be used for commercial products starting in 2028.
Given the timeline, it will be advantageous for the node to implement the High NA lithographwhich Intel intends to implement in the 2025.
It is not known which gods Intel nodes will compete with the1.4 nm di TSMC. Intel plans to launch its technology 18A (18 angstrom) nel 2025then by 2028 the company will have introduced at least one new manufacturing technique.
It will be interesting to see if it is indicated how 16A or 14Aas Intel looks like prudent with improvements to nodes al time.
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TSMC article: 1.4nm process technology research will begin comes from TechGameWorld.com.
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