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AORUS C500 GLASS: the new gaming case from GIGABYTE
Chipset without active cooling: Confirmation from MSI
Contact Frame for Alder Lake: Implemented for Intel CPUs
Rectification for AMD Ryzen 7000: it will consume up to 230W
AMD RDNA3 GPU: New information leaked
Amazon: present eero Pro 6E ed eero 6+
Magic 2 WiFi 6 Mesh Kit: the latest from Devolo
TEAMGROUP formalizes the release of the new DDR5 memory
ASUS: presents the ROG Swift Esports monitor at 500 Hz
Cannon Elite: Antec announces the new Chassis
NZXT: The H7 is back and now anything is possible
PCIe 5.0 SSD: Phison, Micron and AMD work together
Speedlink: presented the new HI-GENIC antibacterial products
MSI Project ZERO: motherboards without circuits
HP: Introducing the new PC HP Pavilion Plus and HP Pavilion x360
AMD: The 16-core Ryzen 7000 CPU reaches 5.5 GHz
ASUSTOR College: new testing center
Computex 2022: ASUS announces its presence
Graviton3: the new CPU from AWS
Mechanical MX keyboards: news from Logitech
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