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Intel Xeon Scalable 3a ufficiali: ben 40 Core a 10nm!
Sony: the new 4K HDR Full Array LED TVs arrive
AMD RDNA 3: nuove GPU chiplet con AMD Active Bridge?
BRAVIA CORE: Sony cinematic entertainment
Arm presents ARMv9: the future between supercomputers and mobile devices
Summit E13 Flip Evo: the convertible according to MSI arrives in Italy
T-FORCE XTREEM: TEAMGROUP lancia RAM fino a 5600 MHz
TSMC: Over $ 100 billion in chip manufacturing investment in three years
ENERMAX MAKASHI II MKT50: new full tower case with E-ATX support
XPG: ecco l’SSD M.2 PCle Gammix S70 Blade
Intel i9-11900K: spinto fino a 7 GHz su GIGABYTE Z590 AORUS TACHYON
ASUS ROG Live 2021: the dates of the event dedicated to PC Building
Corsair: here are the new K55 RGB PRO and PRO XT keyboards
Mi Notebook Pro 15: The new model from Xiaomi with 3.5K OLED display
Kingston NV1: presented the new entry-level SSD with capacities up to 2TB
ENERMAX ETS-F40-FS ARGB and Solid Black: new heatsinks available
XPG XENIA Xe: Intel EVO certified versatile ultrabook
G.SKILL: new DDR4-5333 RAM for Intel Z590
HANNspree announces new monitors with pop-up camera
LEXAR: 3-in-1 Multi-Card Reader awarded at RED DOT DESIGN AWARDS
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